Infineon Technologies has developed the world’s first 300 mm gallium nitride (GaN) wafer know-how, marking a big milestone within the energy semiconductor trade. By leveraging its current 300 mm silicon manufacturing infrastructure, Infineon has created a scalable, high-volume manufacturing course of that enhances cost-efficiency.
The 300 mm GaN wafers supply 2.3 occasions extra chips per wafer in comparison with 200 mm wafers, bettering manufacturing effectivity and gadget efficiency. This innovation positions Infineon as a frontrunner within the quickly rising GaN market, which is projected to succeed in a number of billion {dollars} by the tip of the last decade.
GaN-based energy semiconductors are gaining traction throughout numerous sectors, together with industrial, automotive, client electronics, AI energy provides, photo voltaic inverters, and motor-control methods. GaN know-how presents important benefits, resembling elevated vitality effectivity, diminished dimension and weight, and decrease total prices for finish customers. The brand new 300 mm GaN wafers guarantee better provide stability and scalability, making them supreme for rising market calls for.
Infineon’s integration of 300 mm GaN wafers into its current silicon manufacturing traces in Villach, Austria, demonstrates the corporate’s experience in each GaN and silicon-based semiconductors. This breakthrough additionally paves the best way for price parity between GaN and silicon, significantly when it comes to comparable R DS(on) ranges. Infineon goals to showcase the primary 300 mm GaN wafers on the electronica trade show in November 2024 in Munich.
This development reinforces Infineon’s management in energy methods and its dedication to innovation, significantly within the fields of decarbonization and digitalization. The corporate’s strategic concentrate on GaN, alongside silicon and silicon carbide, highlights its place on the forefront of semiconductor know-how.
Filed in Infineon and Semiconductors.
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